Process

Receiving Lot number assigned. Material counted and entered into Lot database
Incoming Thick, Flats, Films, Broken, Chips, Sort.
Strip Wet Chemistry Tailored to Film Type – Oxide, SiN, Poly, Al, TiN, Photo resist, etc.
Pre Polish Gauge Measure For Thick, Flatness, Resistivity, Type
Stock Polish Controlled Silicon Removal Rates
Final Polish High Purity Final Polish Slurry
Pre Clean Sequential SC1/SC2 Megasonic Cleaning
Dry Yield Up 2000, Steag IPA, or APET dryer
Visual 100% visual inspection for scratches, haze, chips, etc.
Final Gauge Measure 100% for Thick, Type, Resistivity, Flatness
Final Clean Sequenced MegaSonic w/ Dilute SC-1/SC-2/O3
Laser Inspection 100% laser inspection for LPDs. Data stored by Lot on server for C of A
Final QA Quality Dept. samples each lot prior to shipping
Packaging Poly bag, desiccant, foil bag, labels and documents per customer requirement

Capabilities

  • Wafer Size:
    100mm, 125mm, 150mm,
    200mm, 300mm
  • Processes:
    Strip & Etch, Lapping,
    Laser Scribe, Polish, Clean
  • Capacity:
    100,000 wafers / month-Full
    Reclaim (200mm equivalent)
  • Particle:
    <50 @ > 0.12µm on 200mm
    < 50 @ > 0.12µm on 300mm
  • Metals:
    < 1E10 / cm2